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Si-system anode
This is a super heat-resistant polyimide film with a unique composition made from BPDA (biphenyltetracarboxylic dianhydride), which is produced in-house by UBE.
This is a polyamic acid solution that is a precursor of polyimide.
UIP is a polyimide powder based on our proprietary biphenyl tetracarboxylic dianhydride (BPDA), offering excellent heat resistance and various other features.
a-BPDA
2,3,3',4'-Biphenyl Tetracarboxylic Dianhydride
s-BPDA
3,3',4,4'-Biphenyl Tetracarboxylic Dianhydride
A non-adhesive flexible copper-clad laminate based on the polyimide film "Upilex®-VT".
Upisel®-N is a product of UBE EXSYMO Co., Ltd.
UBE is developing a polyimide binder that can suppress the shortening of battery life.
This is an environmentally friendly water solvent varnish that does not use NMP.
The imido oligomer with terminal groups for step-growth polymerization can be used as a matrix resin for high-heat-resistant composites and for high-concentration filler incorporation.
Is it possible to provide samples?
Yes. Please contact us using the inquiry form.
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Please tell me about SDS.
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Please tell me the price.
Please contact us using the inquiry form as it varies depending on the product and grade.
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Please tell us about the product you are developing.
Yes. Please contact us using the inquiry form.
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