UPIA-NF Series
Overview
NMP (1-methyl-2-pyrrolidone) is commonly used as a solvent for polyimide resin, a substance used in a wide range of industries including organic synthesis, semiconductors, and batteries. However, there are health risks associated with NMPs, including skin irritation and respiratory effects from inhalation of vapors. UBE is working on the development of water-soluble polyimide varnishes that do not use NMP as a solvent from both health and environmental perspectives.
Features
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1.Solvent-free
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2.Excellent mechanical properties
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3.Excellent insulation
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4.Low temperature curing possible
(Some developed products)
Applications
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Insulation coating
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Binder
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Substrate
Manufacturing Methods
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1.Spin coat
Apply varnish to the base material.
Uniform by rotation. -
2.Slit coat
The varnish is cast onto the substrate through the slit.
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3.Dip coat
Dip the base material into varnish,
Squeeze out the adhering varnish with a roll. -
4.Spray coat
Apply varnish to the material by spraying it
Apply directly and let it adhere.
Information
Type | Unit | U-Varnish-S | U-Varnish-A | Development1 | Development2 | Test Condition Test method |
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Film thickness | um | 20 | 20 | 20 | 20 | 20 | 10 | ||
Maximum heat treament temperature | ℃ | 200 | 450 | 200 | 350 | 350 | 150 | ||
solvent | ー | NMP | NMP | Water | Water | ||||
Solid Content | wt% | 18.0±1.0 | 18.0±1.0 | 18 | 18 | 350℃, 30min | |||
viscosity | Pa's | 5±1 | 5±1 | 3.5 | 3.5 | 30℃ | |||
Density | 103kg/m3 | 1.10~1.11 | 1.10~1.11 | 1.10 | ー | 25℃ | |||
Strage condition | ℃ | <30℃ | <30℃ | <30℃ | <30℃ | ||||
Film properties |
Tg | ℃ | 267 | 322 | 243 | 274 | 339 | 145 | Dynamic viscoelasticity |
Tensile Strength |
MPa | 235 | 526 | 175 | 229 | 289 | 106 | ASTM D882 | |
Elongation | % | 23 | 35 | 70 | 92 | 96 | 199 | ASTM D882 | |
Tensile Elasticity | GPa | 7.5 | 9.8 | 3.2 | 3.7 | 4.6 | 1.9 | ASTM D882 | |
5% Heat Weight Reduction Temperature | ℃ | 514 | 619 | 546 | 592 | 574 | ー | TGA | |
Insulation Breakdown Voltage | KV | 6.5 | 7.0 | 7.2 | 7.7 | ー | ー | ASTM D882 |