Overview

NMP (1-methyl-2-pyrrolidone) is commonly used as a solvent for polyimide resin, a substance used in a wide range of industries including organic synthesis, semiconductors, and batteries. However, there are health risks associated with NMPs, including skin irritation and respiratory effects from inhalation of vapors. UBE is working on the development of water-soluble polyimide varnishes that do not use NMP as a solvent from both health and environmental perspectives.

Features

  1. 1.Solvent-free

  2. 2.Excellent mechanical properties

  3. 3.Excellent insulation

  4. 4.Low temperature curing possible
    (Some developed products)

Applications

  • Insulation coating

  • Binder

  • Substrate

Manufacturing Methods

  1. 1.Spin coat

    Apply varnish to the base material.
    Uniform by rotation.

  2. 2.Slit coat

    The varnish is cast onto the substrate through the slit.

  3. 3.Dip coat

    Dip the base material into varnish,
    Squeeze out the adhering varnish with a roll.

  4. 4.Spray coat

    Apply varnish to the material by spraying it
    Apply directly and let it adhere.

Information

Type Unit U-Varnish-S U-Varnish-A Development1 Development2 Test Condition
Test method
Film thickness um 20 20 20 20 20 10
Maximum heat treament temperature 200 450 200 350 350 150
solvent NMP NMP Water Water  
Solid Content wt% 18.0±1.0 18.0±1.0 18 18 350℃, 30min
viscosity Pa's 5±1 5±1 3.5 3.5 30℃
Density 103kg/m3 1.10~1.11 1.10~1.11 1.10 25℃
Strage condition <30℃ <30℃ <30℃ <30℃  
Film
properties
Tg 267 322 243 274 339 145 Dynamic viscoelasticity
Tensile
Strength
MPa 235 526 175 229 289 106 ASTM D882
Elongation % 23 35 70 92 96 199 ASTM D882
Tensile Elasticity GPa 7.5 9.8 3.2 3.7 4.6 1.9 ASTM D882
5% Heat Weight Reduction Temperature 514 619 546 592 574 TGA
Insulation Breakdown Voltage KV 6.5 7.0 7.2 7.7 ASTM D882