UPILEX®-S Grade

The standard grade of UBE polyimide "UPILEX®".
Compared to other polyimide films, it has better surface smoothness and higher chemical resistance, greater stiffness and much higher heat resistance. Outgassing is very low, so it is easy to use.

Grades and Area factor of "UPILEX®-S"

Type Grade Thickness (μm) Width* (mm) Area factor (m2/kg)
UPILEX-S 12.5SN 12.5 508,514 54.4
25S 25 508,514/1016,1028 27.2
50S 50 508,514/1016,1028 13.6
75S 75 508,514/1016,1028 9.1
125S 125 508,514 5.4

For custom widths, please contact us.

(1) Mechanical properties

"UPILEX®-S" delivers outstanding mechanical characteristics across a wide temperature range. It also demonstrates high tensile strength and modulus, and even features outstanding long-term heat resistance. Another exceptional feature of "UPILEX®-S" is its high resistance to hydrolysis, as demonstrated by its properties being virtually unaffected even when it is immersed in boiling water for long periods of time.

Property Unit Standard value Measurement
Method
UPILEX
-25S 		UPILEX
-50S 		UPILEX
-75S 		UPILEX
-125S
-269°C -196°C 25°C 300°C 25°C 25°C 200°C 25°C
Tensile strength MPa 740 650 520 290 460 360 270 340 ASTM D882
Stress at 5%
elongation 		MPa - - 260 90 - 210 110 - ASTM D882
Elongation % 10 20 40 70 50 50 80 60 ASTM D882
Tensile modulus GPa - - 9.1 3.7 9.3 6.9 3.8 7.6 ASTM D882
Tear
strength-initiation
[Graves] 		N/mm - - 600 - - 470 - - ASTM D1004
Tear
strength-
propagation
[Elmendorf] 		N - - 3.2 - - 4.2 - - ASTM D1922
Folding
endurance
[MIT]		 Cycles - - >100,000 - - >12,000 - - ASTM D2176
Density ×103kg/㎥ - - 1.47 - 1.47 1.47 - 1.47 ASTM D1505
Coefficient of
kinetic friction
(film-to-film) 		- - - 0.4 - - 0.4 - - ASTM D1894

(2) Electrical properties

"UPILEX®-S" exhibits excellent electrical characteristics over a wide range of temperatures and frequencies. Even at high temperatures, "UPILEX®-S" shows almost no deterioration in its electrical properties, unlike other plastic-type films. It also displays a low level of electrical insulation defects, making it an optimal choice for electrical and electronic uses that demand high reliability.

Property Unit Standard value Measurement
condition		 Measurement
Method
UPILEX-25S UPILEX-75S
25°C 200°C 25°C 200°C
Dielectric strength kV 6.8 6.8 11 11 60Hz ASTM D149
Dielectric constant - 3.5 3.3 3.3 3.2 1kHz ASTM D150
- - 3.5 - 1MHz ASTM D150
Dissipation factor - 0.0013 0.0078 0.0038 0.0056 1kHz ASTM D150
- - 0.0049 - 1MHz ASTM D150
Volume resistivity Ω·m >1014 >1013 >1014 >1014 DC 100V ASTM D257
Surface resistivity Ω >1017 >1015 >1016 >1015 DC 100V ASTM D257

(3) Thermal properties

"UPILEX®-S" boasts the highest heat resistance of any plastic film currently available. Its major features include a high starting temperature for thermal decomposition, smaller values for both heat shrinkage and thermal linear expansion coefficients, as well as flame resistance (UL94 VTM-0). Therefore, "UPILEX®-S" changes little in size even when heated. This makes it ideal for use in FPC and TAB-tape substrates composed of minute circuits.

Property Unit Standard value Measurement
condition		 Measurement
Method
UPILEX
-25S 		UPILEX
-50S 		UPILEX
-75S 		UPILEX
-125S
Thermal linear
expansion
coefficient
(50-200°C)		 ppm/°C 12 16 20 22 Rise rate of
temperature
5°C/min		 Fine linear dilatometer
Heat shrinkage % 0.05 0.02 0.01 0.01 200°C, 2h ASTM D1204
Melting point °C Non - -
Specific heat kJ/(kg·K) 1.13 - Differential
scanningcalorimeter
Heat life
(Tensile strength) 		°C 290 20,000h Fixed
temperature
method
Flammability - V-0 - UL94
Oxygen index % 66 - JIS K7201
Thermal
conductivity		 W/(m·K) 0.29 Thickness
direction		 Laser flash
method

(4) Chemical-resistant properties

"UPILEX®-S" is insoluble in all organic solvents and is sufficiently resistant to virtually all chemicals, including inorganic acid and alkali solutions. This chemical resistance provides exceptional physical properties as well as superior dimensional stability when "UPILEX®-S" is exposed to chemicals. As resistance to various automotive oils (engine oil, brake oil, gasoline, etc.) is strong, it is suitable for use in many automotive applications.

Property Standard value (UPILEX-25S) Measurement
condition		 Measurement
Method
Strength
retention
(%) 		Elongation
retention
(%) 		Modulus
retention
(%)
 Chemical resistance 10% sodium hydroxide 80 60 95 25°C5days Immersion ASTM D882
Glacial acetic acid 100 95 100 110°C 5weeks Immersion
Water PH=1.0 95 85 100 100°C 2weeks Immersion
PH=4.2 95 85 100 100°C 2weeks Immersion
PH=8.9 95 85 100 100°C 2weeks Immersion
PH=10.0 95 85 100 100°C 4days Immersion
Water absorption 1.4% 23°C 24h Water Immersion ASTM D570
0.8% 50°C RH60% Equilibrium
    Gas permeability Water vapor 1.7×10-3kg/m2/25μm 38°C, RH90%, 24h ASTM E96
Oxygen 0.8×10-6㎥/m2/25μm 30°C, 1atm 24h ASTM D1434
Carbon dioxide 1.2×10-6㎥/m2/25μm 30°C, 1atm 24h ASTM D1434

(5) Comparison of film properties

General properties of various heat-resistant films
Property Unit UPILEX
-25S		 General
Polyimide		 Polyester Polysulfone Polytetra
fluoroethylene
Density ×103kg/㎥ 1.47 1.42 1.38-1.41 1.24-1.25 2.1-2.2
Tensile strength MPa 520 170 140～250 60～70 10～30
Elongation % 40 70 60～170 60～110 100～400
Tensile modulus GPa 9.1 3.0 - - -
Tear
strength-propagation
[Elmendorf] 		N 3.2 3.1 4.9～10.8 3.9～4.9 3.9
Chemical
resistance		 Organic
solvents		 - Excellent Excellent Excellent Excellent Excellent
Strong
acids		 - Good Good Good Excellent Excellent
Strong
alkalis		 - Good Poor Good Excellent Excellent
Dielectric constant - 3.5 3.5 3.2 3.1 2.1
Dissipation factor - 0.0013 0.003 0.005 0.0008 0.0002

Modern Plastics Encyclopedia; McGraw-Hill, Inc., New York

(6) Smooth surface

"UPILEX®-S" has a excellent smooth surface with low roughness. Therefore, it can also be suitably used as a film carrier base for other high heat resistance resins, cushioning materials or releasing materials.

Surface
Roughness		 Unit Standard value General
Polyimide 		PET Measurement
Method
UPILEX
-25S		 UPILEX
-50S		 UPILEX
-75S		 UPILEX
-125S
Rms nm 3.8 2.0 2.2 2.1 5.6 - Scanning probe microscope
(Scan area = 10mm x 10mm)
Ra nm 2.1 1.2 1.3 1.1 3.2 22
Rz nm 64.9 60.3 57.8 51.5 100 -

< Carrier base, Releasing material Application Examples >

Since outgassing is very low compared to general polyimide, it is the perfect film for many applications with vacuum and/or high-temperature processing. And, resin coats formed from a carrier base of "UPILEX®-S" have moderate adhesion strength to peel off later and offer a very smooth surface.

Coated/Laminated Resin 180° Peel
Strength
(N/10mm) 		Sample preparation
(Carrier=UPILEX-25S)
Grade Thickness (μm)
Nitto Denko 31B 34 3.0 Laminate 31B and UPILEX-S at room temperature
34 5.2 Laminate 31B and UPILEX-S at room temperature
And leave it for 20h at 70°C
Nichiban LP24 42 2.1 Laminate LP24 and UPILEX-S at room temperature
42 3.8 Laminate LP24 and UPILEX-S at room temperature
And leave it for 20h at 70°C
Epoxy Resin 38 1.21) Coating Epoxy resin on UPILEX-S and curing
1) peel off at an angle of 90°
Epoxy Prepreg 91 1.0 Laminate epoxy prepreg and UPILEX-S
UPILEX-25VT 25 0.08 UPILEX
UPIA-ST (U-Varnish-S) 26 1.1 Coating UPIA-And curing at max 400°C
ST(U-Varnish-S) on UPILEX-S

UPILEX®-RN Grade

"UPILEX®-RN" has many excellent physical characteristics, including molding process-ability and environmental resistance. Therefore "UPILEX®-RN" can be used in embossing, speaker diaphragms, aerospace applications, etc..

  • "UPILEX®-RN" has excellent tolerance not only to acids and organic solvents, but also to alkalis.
  • "UPILEX®-RN" has excellent heat resistance ,electrical properties, and radiation resistance.
  • Since it has excellent elongation through heating and pressing, it is easy to make solid components using drawing process. Molded articles have excellent strength characteristics.
  • "UPILEX®-RN" can form an excellent insulating layer by ribbon winding to a conductor such as a coil , due to it's low modulus and high flexibility compared to "UPILEX®-S".
Grades and Area factor of "UPILEX®-RN"
Type Grade Thickness (μm) Width* (mm) Area factor (m2/kg)
UPILEX-RN 25RN 25 508 28.8
50RN 50 508 14.4
75RN 75 508 9.6
125RN 125 508 5.8

For custom widths, please contact us.

(1) Mechanical properties

Property Unit Standard value Measurement
Method
UPILEX-25RN UPILEX-75RN
Tensile strength MPa 390 380 ASTM D882
Elongation % 160 150 ASTM D882
Tensile modulus GPa 3.9 3.9 ASTM D882
Density ×103kg/㎥ 1.39 1.39 ASTM D-1505-03

(2) Electrical properties

Property Unit Standard value Measurement
condition		 Measurement
Method
UPILEX-25RN UPILEX-75RN
Dielectric
strength		 kV 7.1 13.9 60Hz ASTM D149
Dielectric
constant		 - 3.4 3.5 1MHz ASTM D150
Dissipation
factor		 - 0.007 0.009 1MHz ASTM D150
Volume
resistivity		 Ω·m >1014 >1014 DC 100V ASTM D257
Surface
resistivity		 Ω >1015 >1016 DC 100V ASTM D257

(3) Thermal properties

Property Unit Standard value Measurement
condition		 Measurement
Method
UPILEX
-25RN		 UPILEX
-75RN
Heat life
(Tensile strength) 		°C 270 270 20,000h Fixed temperature method
Flammability - V-0 V-0 - UL94

(4) Chemical property

Property Unit Standard value Measurement
Method
UPILEX-25RN UPILEX-75RN
Water absorption % 1.4 1.7 ASTM D570

UPILEX®-VT and UPILEX®-NVT Grade

"UPILEX®-VT" and "UPILEX®-NVT" are heat bonding polyimide films having heat fusing layers on both side of the film, created by the polyimide resin equivalent of "UPILEX®-S". High quality flexible circuits without an adhesive layer are obtained, by heating and pressing "UPILEX®-VT" or "UPILEX®-NVT" with metal (Cu, SUS, Al) foil. In addition, they are also available for bonding films comprised of metal, ceramic and other materials.

  • Flexible circuits without adhesive are produced.
  • This offers high tensile strength and tear strength.
  • Offering the same low water absorption, low dimensional change and high heat resistance as "UPILEX®-S", with the addition of laminate workability in the heat press.
Grades and Area factor of "UPILEX®-VT"
Type Grade Thickness (μm) Width* (mm) Area factor (m2/kg)
UPILEX-VT 12.5VT 13 510, 520 54.9
20VT 20 510, 520 35.1
25VT 25 510, 520 28.0
50VT 50 510, 520 13.9
PN and Area coefficient of "UPILEX®-NVT"
Type Grade Thickness (μm) Width* (mm) Area factor (m2/kg)
UPILEX-NVT 12.5NVT 13 510, 520 55.1
20NVT 20 510, 520 35.5
25NVT 25 510, 520 28.4
50NVT 50 510, 520 14.0

For custom widths, please contact us.

(1) Mechanical properties

Property Unit Standard value Measurement
Method
UPILEX-25VT UPILEX-50VT
Tensile
strength		 MPa 530 540 ASTM D882
Tear
strength		 N/mm 3.0 4.3 IPC-TM-650 2.4.17.1
Elongation % 90 90 ASTM D882
Tensile
modulus		 GPa 7.5 7.6 ASTM D882
Density ×103kg/㎥ 1.43 1.44 ASTM D-1505-03

(2) Electrical properties

Property Unit Standard value Measurement
condition		 Measurement
Method
UPILEX-25VT UPILEX-50VT
Dielectric
strength		 kV 7.2 10.5 60Hz ASTM D149
Dielectric
constant		 - 3.2 3.3 1GHz Triplate-Line Resonator
3.2 3.3 10GHz Triplate-Line Resonator
Dissipation
factor		 - 0.005 0.004 1GHz Triplate-Line Resonator
0.007 0.007 10GHz Triplate-Line Resonator
Volume
resistivity		 Ω·m >1014 >1014 DC 100V ASTM D257
Surface
resistivity		 Ω >1015 >1015 DC 100V ASTM D257

(3) Thermal properties

Property Unit Standard value Measurement
condition		 Measurement
Method
UPILEX
-25VT		 UPILEX
-50VT
Thermal linear
expansion
coefficient
(50-300°C) 		ppm/°C 20 20 - Fine linear
dilatometer
Heat shrinkage % 0.31 0.35 300°C, 2h JIS C2318
Thermal
decomposition
temp. at 5%
weight loss 		°C 584 582 In Air TG-DTA
Flammability - V-0 V-0 - UL94

(4) Chemical properties

Property Unit Standard value Measurement
Method
UPILEX-25VT UPILEX-50VT
Water absorption % 1.1 1.4 ASTM D570
Moisture Absorption ppm/%RH 14 13 UBE method

UPILEX®-SGA Grade

"UPILEX®-SGA" is a polyimide film having improved adhesion properties created by a special process to both sides of the "UPILEX®-S".
It is suitable for sputtering or plating processes because of high surface adhesion. It offers a flexible base for high-performance electronic circuits.
In addition, it can also be used as an adhesive tape base material for LOC packaging.

  • In sputtering or plating, a flexible base for electronic circuits that does not use any adhesives can be obtained.
  • Peel strength is high, surface smoothness is very high.
  • Superior mechanical property, with low water absorption, excellent dimensional stability and high heat resistance comparable to "UPILEX®-S".
Grades and Area factor of "UPILEX®-SGA"
Type Grade Thickness (μm) Width* (mm) Area factor (m2/kg)
UPILEX-SGA 25SGA 25 508 27.2
50SGA 50 508 13.6

For custom widths, please contact us.

(1) Mechanical properties

Property Unit Standard value Measurement
Method
UPILEX
-25SGA		 UPILEX
-50SGA
Tensile strength MPa 490 490 ASTM D882
Elongation % 40 45 ASTM D882
Tensile modulus GPa 10.0 9.7 ASTM D882
Density ×103kg/㎥ 1.47 1.47 ASTM D-1505

(2) Electrical properties

Property Unit Standard value Measurement
condition		 Measurement
Method
UPILEX
-25SGA		 UPILEX
-50SGA
Dielectric
strength		 kV 6.4 10.6 60Hz ASTM D149
Dielectric
constant		 - 3.4 - 1GHz IPC-TM650 2.5.5.9
Dissipation
factor		 - 0.003 - 1GHz IPC-TM650 2.5.5.9
Volume
resistivity		 Ω·m >1014 >1014 DC 100V ASTM D257
Surface
resistivity		 Ω >1016 >1016 DC 100V ASTM D257

(3) Thermal properties

Property Unit Standard value Measurement
condition		 Measurement
Method
UPILEX
-25SGA		 UPILEX
-50SGA
Thermal linear
expansion
coefficient
(50-200°C) 		ppm/°C 13 14 - Fine linear dilatometer
Heat shrinkage % 0.06 0.06 200°C, 2h ASTM D1204

(4) Chemical property

Property Unit Standard value Measurement
Method
UPILEX
-25SGA		 UPILEX
-50SGA
Water absorption % 1.2 1.4 ASTM D570