UPIA®
"UPIA®" is a complete Polyimide varnish product line based on UBE's "U-varnish" brand,
with new performance varnish grades developed from UBE's extensive experience and Superior technology.
Characteristics of "UPIA®"
(1) Composition of UBE Polyimide
"UPIA®" is a polyimide precursor formed from UBE's proprietary "BPDA(Biphenyl tetracarboxylic dianhydride)" monomers. This is the original UBE varnish.
UBE polyimide film "UPILEX®" is produced using this unique UBE polyimide precursor giving it various and unique advantages. Polyimide coated film derived from the varnish of the same graded has the same properties.
Details of [UPILEX®] is Here.
(2) General properties of "UPIA®"
Property |
Category |
Heat-resistant /High heat-resistant
(Existing grade)
| For secondary battery binder
| Measurement condition |
Unit |
UPIA-AT/ST
(U-Varnish-A/S)
| UPIA-LB |
Solvent |
- |
*NMP |
*NMP, Water |
|
Solid content |
wt% |
17-19 |
10-30 |
350°C, 30min |
Density |
×103kg/m3 |
1.10-1.11 |
1.05-1.15 |
25°C |
Solution viscosity |
Pa·s |
5-100 |
0.1-10 |
E-type, 30°C |
*N-methyl-2-pyrrolidone
(3) Temperature dependence of solution viscosity
(4) Concentration dependence of solution viscosity
"UPIA®" can be used at any desired concentration by diluting it with anhydrous NMP or DMAc (N, N-dimethylacetamide).
(5) Storage stability
"UPIA®" has superior storage stability compared to conventional polyimide varnishes. It exhibits a very low increase in viscosity at room temperature, while conventional polyimide varnish must be refrigerated or frozen.
Other handling precautions are Here
.
Base grade
Heat-resistant varnish UPIA-AT (U-Varnish-A) / High heat-resistant varnish UPIA-ST (U-Varnish-S)
UPIA-AT, UPIA-ST is the same as the U-Varnish-A, U-Varnish-S.
UPIA-AT, UPIA-ST has received high praises of usability and high performance.
(1) Thermal properties
Polyimide film obtained from "UPIA®" exhibits a high thermal decomposition temperature.
Especially, "UPIA®-ST(U-Varnish-S)" has a thermal decomposition temperature above 550°C,
so it does not soften, fluidize, or decompose under use temperatures and it is able to be
used in high-temperature processes.
In addition, the polyimide coating has excellent dimensional stability even at high temperatures.
Property |
Unit |
UPIA-AT
(U-Varnish-A)
| UPIA-ST
(U-Varnish-S)
| Measurement condition/ Method
|
1001 |
1001 |
Thickness |
μm |
20 |
50 |
20 |
50 |
Solvent |
- |
NMP |
NMP |
|
Solid content |
wt% |
18.0±1.0 |
18.0±1.0 |
350°C, 30min |
Solution viscosity |
Pa·s |
5±1 |
5±1 |
E-type, 30°C |
Heat treatment highest temp. |
°C |
350 |
450 |
|
Film properties
| Glass-transition temp.Tg |
°C |
274 |
278 |
322 |
324 |
Dynamic viscoelasticity |
5% weight reduction temp. |
°C |
592 |
599 |
619 |
620 |
TGA |
Thermal linear expansion coefficient
(50-200°C)
| ppm/K |
33 |
29 |
3 |
8 |
Fine linear dilatometer |
(2) Mechanical properties
Polyimide coating derived from "UPIA®" demonstrates excellent mechanical properties, especially high tensile strength and abrasion resistance.
Property |
Unit |
UPIA-AT (U-Varnish-A) |
UPIA-ST
(U-Varnish-S)
| Measurement Method |
1001 |
1001 |
Thickness |
μm |
20 |
50 |
20 |
50 |
Film properties
| Tensile strength |
MPa |
229 |
238 |
526 |
482 |
ASTM D882 |
Elongation |
% |
92 |
99 |
35 |
40 |
ASTM D882 |
Tensile modulus |
GPa |
3.7 |
3.7 |
9.8 |
9.3 |
ASTM D882 |
(3) Electric properties
Polyimide coat obtained from "UPIA®" delivers a high electrical reliability, such as insulation.
Property |
Unit |
UPIA-AT
(U-Varnish-A)
| UPIA-ST
(U-Varnish-S)
| Measurement condition/
Method
|
1001 |
1001 |
Thickness |
μm |
20 |
50 |
20 |
50 |
Breakdown voltage |
kV |
7.7 |
10.3 |
7.0 |
10.2 |
ASTM D149 |
Volume resistivity |
Ω·m |
>1014 |
>1014 |
>1014 |
>1014 |
ASTM D257 |
Surface resistance |
Ω |
>1016 |
>1016 |
>1016 |
>1016 |
ASTM D257 |
(4) Chemical-Resistant Properties
"UPIA®" has excellent resistance to common organic solvents and metallic salt solutions, and it also
demonstrates better resistance to acids and alkalis than conventional products.
In addition, it delivers superior performance when it comes to abrasion resistance and non-
flammability.
Chemical resistance data of UPIA-AT-1001(U-Varnish-A)
Chemical |
Characteristic value (Thickness: 20μm) |
Strength retention rate (%) |
Elongation retention rate (%) |
Methylene chloride |
95 |
96 |
Chloroform |
88 |
90 |
Trichloroethylene |
93 |
102 |
Methyl ethyl ketone |
92 |
89 |
Ethanol |
89 |
100 |
Xylene |
99 |
84 |
m-Cresol |
90 |
90 |
N-methyl-2-pyroridon |
98 |
107 |
Glacial acetic acid |
91 |
108 |
10% hydrochloric acid |
91 |
82 |
10% sulfuric acid |
93 |
94 |
2% sodium hydroxide |
99 |
91 |
10% sodium hydroxide |
82 |
81 |
Measurement condition: 30°C, 24h Dipping
Specialty grade (Details)
We will continue to develop special varnish grades delivering unique advantages for specific applications, based on properties of high heat resistance and chemical resistance.
(1) For secondary battery binder UPIA-LB
We have optimized UPIA-LB for lithium-ion battery binder applications.
- For battery binder applications, we strengthened and optimized the required characteristics according to our customers needs.
- UPIA-LB has the necessary toughness to overcome significant expansion of the electrode material.
- This varnish has high adhesion to Copper, aluminum and SUS, so you should improve the adhesion to the current collector compared to other binder types.
- This polyimide binder is highly resistant to the chemical exposure, it maintains performance, such as cracking resistance and adhesive strength, even immersed in the electrolyte solution
- It has excellent long-term heat resistance, so it is able to be used in high-temperature applications.
- UPIA-LB has excellent physical properties, even with relatively low temperature processing.
Property |
Unit |
UPIA-AT (U-Varnish-A)
| UPIA-LB |
Measurement condition |
Measurement Method |
1001 |
1001 |
2001 |
Thickness |
μm |
20 |
20 |
20 |
20 |
20 |
20 |
Heat treatment highest temp. |
°C |
200 |
350 |
200 |
350 |
150 |
200 |
|
|
Solvent |
- |
NMP |
NMP |
Water |
|
|
Solid content |
wt% |
18.0±1.0 |
30.0±1.0 |
18.0±1.0 |
350°C, 30min |
|
Solution viscosity |
Pa·s |
5±1 |
5±1 |
0.5±0.2 |
E-type, 30°C |
|
Film properties |
Cu adhesion |
- |
5B |
5B |
5B |
5B |
5B |
5B |
|
ASTM D3359 |
Al adhesion |
- |
5B |
5B |
5B |
5B |
5B |
5B |
|
ASTM D3359 |
SUS adhesion |
- |
5B |
5B |
5B |
5B |
5B |
5B |
|
ASTM D3359 |
Tensile strength |
MPa |
175 |
229 |
199 |
278 |
127 |
132 |
|
ASTM D882 |
Elongation |
% |
70 |
92 |
88 |
107 |
53 |
45 |
|
ASTM D882 |
Tensile modulus |
GPa |
3.2 |
3.7 |
3.2 |
4.0 |
2.8 |
3.2 |
|
ASTM D882 |
Break energy |
MJ/m3 |
86 |
150 |
118 |
191 |
70 |
75 |
|
ASTM D882 |
Electrolytic liquid resistance
| Weight change rate |
% |
+1.2 |
+0.2 |
+0.1 |
±0 |
±0 |
±0 |
25°C×24h
Electrolytic liquid dipping |
|
Thickness change rate |
% |
+0.5 |
±0 |
+0.1 |
±0 |
±0 |
±0 |
25°C×24h Electrolytic liquid dipping |
|
Tensile strength retention |
% |
97 |
100 |
103 |
102 |
98 |
100 |
25°C×24h
Electrolytic liquid dipping |
ASTM D882 |
Elongation retention |
% |
100 |
99 |
103 |
103 |
104 |
100 |
25°C×24h
Electrolytic liquid dipping |
ASTM D882 |
Break energy retention |
% |
100 |
100 |
102 |
104 |
101 |
100 |
25°C×24h
Electrolytic liquid dipping |
ASTM D882 |